High Density Interconnect PCB Steppers

“KBTEM-OMO” concern “Planar”

www.planar.by

By the enlargement of working frequencies of electronics devices, and also by the increase of contact number of a semiconductor chip till some hunsdreds, traditional assembling technology (wire bonder) didn’t provide the increasing demands on high-performance and reliability. The traditional chip assembling failed to satisfy constantly increasing demands on decreasing of the dimensions and the weight of new devices, and improving of thermal performances.

In new assembling technology on contact areas semiconductor chip are formed contact's ledges (balls). Then the Ball Grid Array is soldered directly to contact areas of the printed-circuit-board (PCB). These contacts balls replace connecting wires of traditional technology of microcircuits assembly.

Such assembling technology is used in production of high-performance electronics. And, first of all this is the production of modern PC, microprocessor module of various purposes, mobile telephones.

The traditional equipment of contact exposure can’t now provide increasing demands. More often instead of contact lithography equipment are used steppers with the projection (non-contact) pattern image transfer to the circuit board. The main PCB steppers’ producers are Japanese companies.

By the enquiry of Taiwan Company CSUN the Belarus enterprise KBTEM-OMO developed, produced and delivered High Density Interconnect (HDI) PCB Stepper EM-5434 in 2003.

PCB stepper is intended for fulfilling photolithography technological operation for HDI PCB production.

The leading companies, producing HDI PCB in Taiwan, carried out production tests of HDI PCB stepper EM-5434. Taking into account the main parameters, HDI PCB stepper doesn’t inferior to the similar equipment from Japan and USA.

KBTEM-OMO got from Taiwan customers new contract for the development on the base of EM-5434 more perfect PCB stepper.

EM-5434A stepper with narrow field and light stitching capability is the most optimum equipment type for fulfilling lithography operation for assembling of microcircuits production today and in the nearest future.